EXFO, the communications industry’s test, monitoring and analytics experts, will share innovations in fiber optic electrical and optical testing and interconnectivity supporting rapid adoption of generative AI at OFC 2024 in San Diego this week.
Datacenter, cloud, and network providers will benefit from EXFO’s automated PIC testing, complete electrical-to-optical transceiver testing, and the latest 400/800G network and datacenter test innovations, to be demonstrated at Booth #1017.
Widespread adoption of generative AI has put pressure on providers to ramp up network and interconnect speeds while ensuring high-quality communications with low latency. EXFO’s lab and field solutions in PIC and transceiver testing are supporting burgeoning manufacturing production required to supply growing demand for 800G high-speed networks.
PIC testing is taking a huge step forward with the introduction of EXFO’s OPAL-MD multi-die PIC testing station, a compact, and automated probe station. As part of the OPAL series spanning wafer to single-die characterization, the OPAL-MD is the industry’s most accurate, repeatable, and traceable PIC testing solution, delivering unsurpassed fast and efficient testing.
Lab and field testing have advanced with EXFO’s complete electrical-to-optical testing for high-speed systems, and the industry’s first compact validation tool for 800ZR coherent pluggables. Available in rackmount or portable configurations, EXFO’s modular 400G, 800G and 1.6TB solutions bring speed and flexibility to customers’ test programs.
In addition, EXFO’s Exchange platform automates field testing and reporting to optimize operations.
Etienne Gagnon, senior vice-president test and measurement at EXFO
EXFO is pleased to support the generative AI revolution with solutions that ensure flawless network deployment, reliable interconnect for legacy networks and new technologies, and high-quality test, measurement, and monitoring throughout the complete network lifecycle, from the lab to fabrication, and fabrication to live.
