To streamline and facilitate a back-end manufacturing ecosystem for PICs, OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced a strategic partnership with Jabil, a global manufacturing solutions provider.
With this collaboration, OpenLight customers can fast-track the manufacturing and delivery of integrated PICs across a wide variety of applications and markets, including datacom transceivers, automotive LiDAR, AI/ML, HPC, and healthcare.
As PICs become increasingly critical to address the growing demand for faster data processing, supply chain complexities hinder seamless transitions from silicon wafers to packaged heterogeneous integrated systems. This partnership offers one-stop "Silicon to Solutions" services to accelerate end-to-end production and optimize manufacturing efficiencies – from assembly and packaging to burn-in and testing.
The unique collaboration puts both companies at the forefront of revolutionizing the silicon photonics manufacturing landscape, eliminating associated supply chain challenges and meeting the volume demands of high-bandwidth components for the broad markets both companies serve.
Adam Carter, CEO of OpenLight
We are very pleased to work with such a prominent global leader in high-volume manufacturing and together, we look forward to enabling a holistic path for our customers to take our PASIC wafers to packaged solutions for the markets and applications we serve. This will simplify the management of our customers' supply chain, paving the way for scalability as their business grows.
Matt Crowley, SVP Cloud and Enterprise Infrastructure of Jabil
As we continue to invest and grow our existing capabilities for manufacturing optical solutions for our customers, we are excited to partner with OpenLight and leverage its unique business model to produce PASIC solutions. Combining their expertise with Jabil's high-volume experience in optical packaged solutions, we're poised to deliver exceptional value to our customers. At Jabil, we also have the ability to take these PICs and build them into a wide variety of packaged solutions per our customer's requirements.
